Expoxy Resin HW (CAS 1675-54-3)

Expoxy Resin HW (CAS 1675-54-3) is a chemical compound registered under number CAS 1675-54-3, with the molecular formula C₂₁H₂₄O₄, and a molar mass of 340.4 g/mol.

The molecule contains 49 atoms connected by 52 chemical bonds. The full systematic IUPAC name of this compound is 2-[[4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane. The interactive 3D model above lets you view the spatial arrangement of the atoms — you can rotate it with the mouse, zoom with the scroll wheel, and switch between skeletal / Ball & Stick / Space Fill visualization modes.

In terms of physicochemical properties, the partition coefficient logP = 4 (positive value, a lipophilic compound), polar surface area PSA = 43.5 Ų, 0 donors and 4 hydrogen bond acceptors. These parameters are key when assessing bioavailability and interaction with biomolecules.

Chemical data for this compound comes from PubChem (NIH NLM NCBI), one of the world's largest chemical databases. All information is updated automatically and enriched with GHS hazard statement translations compliant with the CLP Regulation (EC 1272/2008). The widget above may be used for educational, research and commercial purposes.

Sygnał: Uwaga

H315 — Działa drażniąco na skórę

H319 — Działa drażniąco na oczy

H317 — Może powodować reakcję alergiczną skóry

• 📊 PubChem CID 2286 — NIH
• 🔬 NIST WebBook — spektroskopia
• 🌐 Wikidata
• 💊 ChEMBL — bioaktywność